This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
CC2640R2 (BLE5)
Note: The following instructions have been written for SDK 3_40_00_10 but can be adapted to quite any SDK version (that is why I provided the sources but also the diff files)
At the end of this instruction, your project won’t be able anymore to pair. The goal is to save space in FLASH and RAM memory.
This modification is slightly more advanced but it's worth the money!
How to do this?
--- C:\ti\simplelink_cc2640r2_sdk_3_40_00_10\examples\rtos\CC2640R2_LAUNCHXL\ble5stack\simple_peripheral\src\app\simple_peripheral_without_connection_params_update.c Wed Feb 12 15:55:05 2020 +++ C:\ti\simplelink_cc2640r2_sdk_3_40_00_10\examples\rtos\CC2640R2_LAUNCHXL\ble5stack\simple_peripheral\src\app\simple_peripheral_SIMPLE.c Wed Feb 12 17:29:48 2020 @@ -524,9 +524,8 @@ // section in the User's Guide: // http://software-dl.ti.com/lprf/ble5stack-latest/ { - // Don't send a pairing request after connecting; the peer device must - // initiate pairing - uint8_t pairMode = GAPBOND_PAIRING_MODE_WAIT_FOR_REQ; + // Pairing is not possible + uint8_t pairMode = GAPBOND_PAIRING_MODE_NO_PAIRING; // Use authenticated pairing: require passcode. uint8_t mitm = TRUE; // This device has no display capabilities.
In the stack project (named ble5_simple_peripheral_cc2640r2lp_stack_library), in the file TOOLS/ build_config.opt, remove the declaration of the symbol GAP_BOND_MGR
Here is the diff file and the file you are supposed to get if you do the modification:
--- C:\ti\simplelink_cc2640r2_sdk_3_40_00_10\examples\rtos\CC2640R2_LAUNCHXL\ble5stack\simple_peripheral\src\app\build_config.opt Wed Feb 12 17:43:17 2020 +++ C:\ti\simplelink_cc2640r2_sdk_3_40_00_10\examples\rtos\CC2640R2_LAUNCHXL\ble5stack\simple_peripheral\src\app\build_config_SIMPLE.opt Wed Feb 12 17:27:47 2020 @@ -122,7 +122,7 @@ /* -DGATT_DB_OFF_CHIP */ /* Include GAP Bond Manager */ --DGAP_BOND_MGR +/* -DGAP_BOND_MGR */ /* BLE v4.1 Features */ /* -DV41_FEATURES=L2CAP_COC_CFG */
Build the stack project and the application project
Test your program. Everything should still work smoothly!
Here are the links to the different threads I wrote regarding simple_peripheral FLASH size optimization:
Remove display CC26x2 / CC13x2: e2e.ti.com/.../879276
Remove display CC2640R2: e2e.ti.com/.../3252666
Remove #2 advertisement CC26x2 / CC13x2: e2e.ti.com/.../3255504
Remove #2 advertisement CC2640R2: e2e.ti.com/.../880139
Remove RSSI monitoring and auto PHY update CC26x2 / CC13x2: e2e.ti.com/.../880155
Remove RSSI monitoring and auto PHY update CC2640R2: e2e.ti.com/.../880151
Remove connection params updates CC26x2 / CC13x2: e2e.ti.com/.../880171
Remove connection params updates CC2640R2: e2e.ti.com/.../880163
Remove pairing CC26x2 / CC13x2: e2e.ti.com/.../880181
Remove pairing CC2640R2: e2e.ti.com/.../880177