We are using the RI-SMD-MRD2 and is there any issues we need to consider when applying potting compound material around this assembly? The potting material will coat the assembly. We need to do this due to the environment that it will be exposed. Wondering if there are any issues with doing this or things to be considered?
The RI-SMD-MRD2 is mounted onto typical FR4 PCB material.
Thank you.