RF430CL330H: RF432S72FDMWRGZRQ1 Immobilizer Voltage build up Discrepancy

Part Number: RF430CL330H

Tool/software:

In ther inital iteration of using this chip which was designed inhouse and post validation it given to a vendor for design based on the inhouse schematic. A discrepancy was noticed in the immobilizer action max working distance compared to the inhouse designed MK2 FOB where both have the same schematic and component values.

Inhouse FOB max Immo distance: 5CM from transmitter antenna

Vendor FOB max Immo distance: 3CM from transmitter antenna

VDDSW caps in both the design: 1uF/25V + 100nF/25V

Post the CL caps they are connected to both the VDD pin with 100nF/25V caps on each pin as shown below

Both the FOB designs use the same LF 3 axis antenna from sumida CAS13D31B-472

Measurement

The LF burst duration from the transmitter is 150mS. Upon measuring the voltage build up on the VDDSW caps we found the below waveform.

Note: Transmitter antenna and module was exactly the same for both the FOBs during testing.

Image 1: Voltage on VDDSW caps of Inhouse designed FOB at 5CM

Image 2: Voltage on VDDSW caps of Vendor designed FOB at 5CM

In the inhouse designed FOB waveform we can see that the voltage constantly builds up for 150mS and reaches till 2.84V but in the vendor designed FOB waveform we can see that voltage quickly builds up to 1.3V and then gradually rises to peak voltage of 1.48V.

Steps taken to mitigate the issue

  1. The same firmware was flashed on both the RF432 chips ensure the wake pattern in same.
  2. Used the capacitors of exact same MPN on both the FOBs.

Conclusion

The discrepancy exist even after making all the above changes.

  • Hi,

     I'm currently out of office and will look into your question when I come back next Monday.

  • Hi, 

      Sorry for the late reply as I was out of office since Wednesday and just got back. 

    Steps taken to mitigate the issue

    1. The same firmware was flashed on both the RF432 chips ensure the wake pattern in same.
    2. Used the capacitors of exact same MPN on both the FOBs.

    Conclusion

    The discrepancy exist even after making all the above changes.

    Other than the schematic, is the board layout the same? Is the board the housed differently between the two?

  • Hi Charles,

    The board layout is not same and yes there is a slight difference in housing, but as of now I am doing PCBA level board to board comparision. We don't have the board layout from the vendor but it was informed to us that they hod done one round of verification with TI folks.