Hi
this should be bee board [url]http://www.seeedstudio.com/wiki/Bluetooth_Bee[/url] with TI cc2540/cc2541 bluetooth low energy MCU [url]http://www.ti.com/product/cc2540&DCMP=LowPowerRFICs+Other&HQS=Other+OT+cc2540[/url]
I probably made design mistakes and will be glade to hear from you
1) I design the PCB antenna from spec [url]http://www.ti.com/lit/an/swra117d/swra117d.pdf[/url]
DRC return overlap error of some antenna parts, corner and connection
what to do with it? is the antenna connection is wrong?
2) balun part [url]http://www.ti.com/lit/an/swra380a/swra380a.pdf[/url]
this part probably need via under, as you can see the 20 mil via is little bit big and over three pads all ground.
DRC return overlap and clearance errors, can I ignore it as it is overlap ground pads? is the via really needed?
is the via under the MCU should look like in the picture?
any suggested via size (the PCB house "batchpcb" have 20 mil drill limiting, should I change PCB house?)
the board is two layers, both are GND plated? is it ok? is there enough GND plate in my board?
isolation 8mil , copper top and button 0.035mm, isolation layer 1.5mm, total 1.57 mm, from readme file of mini kit "PCB DESCRIPTION:4 LAYER PCB 1.6 MM", is it ok?
add some vias between top button ground layers, is it enough? more than needed?
is the distance from CC254x to balun is too far enough? if so what should I do to keep the same distance and still to make it work?
any other issues you see?
BR




