Other Parts Discussed in Thread: CC2541, CC2540
Hi
this should be bee board [url]http://www.seeedstudio.com/wiki/Bluetooth_Bee[/url] with TI cc2540/cc2541 bluetooth low energy MCU [url]http://www.ti.com/product/cc2540&DCMP=LowPowerRFICs+Other&HQS=Other+OT+cc2540[/url]
I am posting second board (first board http://e2e.ti.com/support/low_power_rf/f/155/p/208830/741982.aspx) after comments of TA12012 and Fredrik K (thanks you help alot)
in generaly which issues you can inspect in this design?
TA12012 remarks
1) "to many cutouts"
I am new to this what are exactly the cutout (black square without ground?), this is two layers board any way to reduce this cutouts
2) " Copy the reference design for the balun"
did it, is it look ok?
3) "You need to make your ground plane a ground plane, that is you cannot have traces in the ground plane"
I can not see away to do it in two layers board, is it mean it will not work/ drastic limit the receive/ transmit ?
do you have any idea how to solve it (increase board size+ground in specific direction, add some passive competences, other)
Fredrik K remarks
1) "VDD trace on the bottom layer going underneath the RF traces"
moved it
2) " The antenna is too close to the ground plane"
it is now like the reference, W2 = 0.5mm, L6=4.9mm, D4=0.4mm, L1=3.94, is it look ok?
3) "I would change to 0.3mm vias"
change it to 0.3mm, is there enough vias or need more?
4) "The decoupling capacitors should preferably be even closer to the power pins"
did my best, is it ok? which need to move closer?
thanks
Natanel






