CC110-PCN

Turker Demir

Other Parts Discussed in Thread: CC1101

Hello Team,

Major distributor's question is below.

Customer uses the CC1101.
In the current PCN TI informs that the package dimensions are changed.
But how influence the PCN the size of "F" (Pads length) and Thermal Pad
size??

Thank you,

Turker

over 13 years ago

0 Sverre over 13 years ago

TI__Mastermind 39860 points

The PCN writes "The sawn RGP package is considered backwards compatible with the punched RTK package, i.e. no PCB footprint change is necessary."

(RTK is "old" and RGP is the new package)

0 David Simpson2 over 13 years ago in reply to Sverre

Prodigy 10 points

It's nice that is suppose to be compatible, but what is the value of dimension "F"?

It is missing on the drawing, which should be updated to contain this information.

0 TER over 13 years ago in reply to David Simpson2

TI__Guru**** 317180 points

F=0.4+/-0.1

0 Joan Griera Tornamira over 13 years ago in reply to TER

Prodigy 10 points

What about Thermal Pad dimensions?

0 TER over 13 years ago in reply to Joan Griera Tornamira

TI__Guru**** 317180 points

Unchanged, 2.4+/-+0.1

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