CC1200 - best layer stack-up in case of 6 or 8 layers

A 6 or 8 layer board should have the same distance from the signal layer (The layer CC1200 is placed on) to the next layer (that should be ground) as the reference design (See the readme.txt http://www.ti.com/tool/CC120XEM-868-930-RD)

As long as a solid ground plane is used as layer 2 and this is the recommended distance to layer 1, layer 3- have low importance.

Hi,

QUESTION 1

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Could anybody tell me if this 6-layer stack-up is fine for a CC1220 transceiver?

1 - S1 - Routing of RF signals
2 - GND
3 - S2 - Digital signals like SPI
4 - GND
5 - POWER 3.3 V
6 - GND

The POWER plane is sandwiched between 2 ground plane layers and should show a distributed capacitance very effective at the radio frequencies.

QUESTION 2

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Are there any better 6-layer stack-ups for a CC1220 transceiver?

Thanks,

Enrico Migliore

- Why are you targeting 6 layer board? From the stack-up it could look like you could use a 4 layer board? (S1-GND-S2-Power)

HiTER,

I need a solid ground plane at the bottom of the board because:

1. A power plane is not as clean as a ground plane.

2. I want to use a metal shield on top of the board in order to prevent RF fields to exit the board.

Enrico Migliore

This is to an issue for a 4 layer board with output power up to 27 dBm where the power routing is on layer 3.

A 6 layer board with the stack-up you suggest will be a good solution but if it's not required it is a extra cost.