Hello All,
I am designing PCB layout for CC1310 4x4 mm (RSM package). I downloaded the footprint from TI website.
In the footprint, the thermal pad of the microcontroller is grounded. I have 2 question now:
1- Can I place through-hole Vias in the thermal pad and connect the vias to the common ground?
2- If so, can I connect the grounded pin of the microcontroller (e.g. pin# 3,7,17,20) internally to the grounded thermal pad?
Thank you in advance.
