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Hi,
I have a strange issue...CC1101 IC burned out (see picture in attachment). I have about 10 devices with similar issue. So, device: RF module connected to WiFi IC (MT7628).
Chip package temperature doesn't exceed 55 C during the working cycle. Other elements mounted on PCB stay ok. Schematic in attachment too.
I use the same power source (3.3 V) for CC1101 PCB and QuadSPI flash memory IC. Flash memory IC was not damaged. I can't explain this phenomenon...
Not sure what you mean by " IC burned out" and the picture does not show any details either?
Ok, not that often I see pictures that shows that the IC has been so hot that the PCB is black... This is most likely due to a short, you should check the impedances on the board and see where it's close to 0.
Also, from what I can see from the picture, the layout is not optimal. I hope this is more than 2 layers because chip ground is poorly connected on the button layer. The RF path toward the antenna is also poor. Follow the ref design and also look at http://www.ti.com/lit/ds/symlink/cc1101.pdf
Yeah, layout isn't optimal, I know...Additional detail: devices works fine for 1-3 weeks. I measured all possible impedances before and after CC1101 burning out event - its ok.
Is it just this board that have had this problem?
Could the board been exposed for a ESD event?
I have about 10 boards with that problem (and no one that works fine longer than 3 weeks).
Board is packed to the plastic case. So, it can be damaged by ESD event only via SMA antenna connector.
10 boards out of how many? It's not often a ESD is seen as a systematic error but we have sen cases with poorly grounded production lines that cause a large fall out due to ESD.
What is the value of VCC in your design?
I could also do a layout review to see if I see something that could potential cause this. For this I would need gerber files.