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LAUNCHXL-CC1352R1: Custom design excluding energy trace

Part Number: LAUNCHXL-CC1352R1
Other Parts Discussed in Thread: CC1352R, CC1350, CC1310, ENERGYTRACE, CC1312R

Hey guys,

we want to design our board based on the CC1352R1 Launchpad. Since we are basically satisfied with the performance we are planning to remove the whole energy trace stuff and keep most of the rest.

What we need is obviously the CC1352R1 chip and the RF path for the sub GHz application. Besides, we keep the XDS Probe circutry to be able to flash the device via USB. Both mini JTAG Header will be removed as well. Since we do not have an altium licence (re-design will be outsourced) I was wondering if

  1. we can simply remove all the energy trace stuff (all from page 5 + 6 of the rev. B schematics of the launchpad) without further adaptions
  2. and is there a possibilty to view the board files with EAGLE?
  3. Is there a recommendable replacement for the RF frequency filter? According to Murata, this device is currently not available on the market. I found this so far: LFD21892MDP2B860

Best wishes

Slev1n

  • 1) What you need is page 1 on the schematic. I would use the XDS from a separate board to flash the CC1352R. 

    2) Our designs are done in Cadence.

    3) LFD21892MDP2B860 does not cover 2.4 GHz. If you don't find a diplexer with similar performance as the one we use on the LP you can use a RF switch. 

  • Hey TER, thank you for your fast reply.

    1) What you need is page 1 on the schematic. I would use the XDS from a separate board to flash the CC1352R. 

    I dont see the benefit in using a second board for the XDS probe. For our product we need on the fly updates using a gateway and to my understanding, there is an XDS probe necessary for flashing the chip. Besides, the USB port is quite practible for our application. Hence, we would rather only get rid of the energy trace stuff.

    Is this a complex redesigning task if the XDS part is kept?

    Besides, if we would keep the design and simply not place the expensive chips from the energy trace / calibration part, do you see any obstacle by doing so?

    EDIT: I wonder if we could just use the CC1310 or CC1350 launchpad design regarding the removement of the energy trace stuff, right?

    2) Our designs are done in Cadence.

    Do you know a freeware tool to somehow have a look at the files without having a Cadence license? Besides, our partner so far uses altium, can he use your Cadence files?

    3) LFD21892MDP2B860 does not cover 2.4 GHz. If you don't find a diplexer with similar performance as the one we use on the LP you can use a RF switch. 

    Well, I shoud have mentioned, that we are not using 2.4 GHz currently, thus a simple filter for sub GHz would be sufficient. We wanted to keep a similiar component regarding certification.

    Best wishes

    Slev1n

  • 1) Not following you. I would assume that you would like to do updates with OAD (and then you don't need the XDS110)

     If you would like the XDS110 without energytrace the best is to start from CC1310.

    2) I can generate an .alg file that is possible to import into altium for the layout part.

    3) CC1352R is a dual band device. If you are not planning to use 2.4 GHz, why not use CC1312R? The diplexer is used to combine the sub 1 GHz path and the 2.4 GHz path and hence if you are only interested in sub 1 GHz this part is not needed.

  • 1) Not following you. I would assume that you would like to do updates with OAD (and then you don't need the XDS110)

     If you would like the XDS110 without energytrace the best is to start from CC1310.

    I should have been more clearly on this. The collector (we use sensor collector software) is connected via usb to a raspberry pi. We use that connection for updating the firmware on the collectorboard. And I guess we will follow the design of CC1310. We just thought it would be a quicker approach to simply not place the energy trace components for the next batch. 

    2) I can generate an .alg file that is possible to import into altium for the layout part.

    If you could provide us with such a file for the CC1352R1 and CC1310 launchpads would be great.

    3) CC1352R is a dual band device. If you are not planning to use 2.4 GHz, why not use CC1312R? The diplexer is used to combine the sub 1 GHz path and the 2.4 GHz path and hence if you are only interested in sub 1 GHz this part is not needed.

    I remember switching from CC1310 to CC1352R1 since we needed more space for devices in the network. Is the memory the same for both chips? What are the benefits of this chip type?

    best wishes

    Slev1n

  • They can start from the .alg file provided here: https://e2e.ti.com/support/wireless-connectivity/sub-1-ghz/f/sub-1-ghz-forum/881783/webench-tools-lpstk-cc1352r-lpstk-cc1352r

    The differencea between CC1312R and CC1352R are:

    - Pinout. CC1310 and CC1312R are pin compatible

    - CC1312R supports sub 1 GHz and CC1352R supports both sub 1 GHz and 2.4 GHz.

  • Thanks for the reply.

    Since the memory size is the same of both chips this seems to be a good alternative. thanks for the hint.