Other Parts Discussed in Thread: WL1835, WL1837
We have used the WL1835 for years and they solder down and perform well.
Now we use the WL1837 and are having solder / performance issues.
On some boards they work, on some they don't. I have tried thermal relief on the ground connections
to improve (Board is 18 layer), but I can't understand why these parts are so difficult to reflow.
but most of my designs are. Lot is LTC:32WMDQCR
10.1.6 Baking and SMT Recommendations from datasheet SWRS170j is observed.
Even after x-ray where solder looks great, some do not perform as expected.
Any tips from process engineer would be appreciated. - Patrick
REV2 
REV3 
LTC:32WMDQCR.