Hi,
I am using a WL1805 module on my board, and have some soldering process issues that cause voids on the power pads.
WL1805 datasheet provide the Thermal Resistance from junction to air; junction to board and junction to case. These values are assume to be correct in a good reference PCB with good solders.
How the thermal resistances evoluate when voids are present in the solder ? How can I estimate the product lifetime degradation ?
PS : the soldering is approximatively 50% of the power pad area. All design recommandation (copper area on the PCB) are respected.
Thank you for your feedback.