CC3220MOD: Thermal vias on the IC pads on the LAUNCH-CC3220MODSF board

prachi p

Part Number: CC3220MOD

Hi,

On the LAUNCH-CC3220MODSF PCB layout, the are thermal pads on the bottom of module each have four vias.

For the manufacturing process, open vias in pads are avoided because the solder is sucked off the pad and down the hole due to capillary action. Please let me know if this is the recommended layout for this module. Also, I want to know why there are vias provided only under the pads and not elsewhere on on the ground under the module.

Regards,

Prachi

over 7 years ago

0 Charles Oladimeji over 7 years ago

TI__Mastermind 33805 points

Hi,

I believe the recommendation is to have filled vias. The vias are provided only under the ground pad because they are for thermal dissipation from the module.

Regards,
Charles O

0 prachi p over 7 years ago in reply to Charles Oladimeji

Intellectual 300 points

Hi Charles,
Thanks for your response.
In case if filled vias are not feasible during fabrication, then would it be fine to have these vias to be moved to somewhere near the pads instead of directly under them? What is the recommendation in that case?
Regards,
Prachi

0 prachi p over 7 years ago in reply to prachi p

Intellectual 300 points

Hi,

Can you please update me on my query?

Regards,
Prachi

0 Charles Oladimeji over 7 years ago in reply to prachi p

TI__Mastermind 33805 points

Hi,

Please see section 3.4.1 of the linked document
www.ti.com/.../slua271a.pdf

The thermal properties of the pad is different without the vias. Please follow the recommendation in the datasheet.

Regards,
Charles O

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CC3220MOD: Thermal vias on the IC pads on the LAUNCH-CC3220MODSF board