Hello
I need you help I need to know the criteria for allowable voids in the pads. We are assuming no more than 30% is this correct. We are using the recommended solder parameters. We used a mole to verify. I am seeing to many voids. We tried N2 and lengthening the soak but either worked. We are using a 5 mil stencil and a 12 zone oven we have SPI. Can you help us with any process improvements we do not want to put good parts in the land fill.
Hello Saurabh
yes we are using it on one of my customers boards. All the boards I built show similar thing at Ray we followed all the recommendations. Our experiments with N2 and lengthening the soak have not produced any better results. I have the boards on hold but all of them look like they need to be replaced. If you need more data or information I can provide it. I will attach a picture of two of the parts. If you need more X-Ray images I can provide these thank-you for your help.
