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WL1835MOD: SMT mounting of the WL1835MOD device

Tim Kielbon
Prodigy 10 points
Part Number: WL1835MOD

May this device be placed on the circuit board with less than 5mils of solder paste?  We have a number of 0201 components about this IC and are not able to attain the 5mil paste thickness.  2 to 3 mils seems to be the thickness we will be able to achieve.

  • 0
    TI__Prodigy 725 points
    I will need to double check and will let you know once I confirm.

    Oscar
  • 0
    TI__Prodigy 725 points
    Below is from our SMT expert, let me know if this resolves your issue.


    5 mil thick stencil is too thick for 0201 component. Solder paste won’t be able
    to print onto the PCB pads due to area aspect ratio.

    On the other hand, 2-3 mil stencil would put too less solder paste onto the PCB
    for WL1835MOD. The solder joint form will have very low standoff affecting the
    joint reliability.

    Suggestion : Depends on the number of 0201 and other component that require a
    different stencil thickness. Customer can fabricate a step up stencil
    that increase the thickness of WL1835MOD location. You can
    fabricate a step down stencil reduce the stencil thickness at
    locations that require a thinner stencil.