Hi ,
I am using WL1835MOD in one of my custom design which is a multi-layer board(8 layers). In PCB , we have routed the RF trace , placed impedance matching networks and antenna location as same as in TI reference design in order to reuse the FCC certification. We have been using on board chip antenna TDK's part(P/N: ANT016008LCD2442MA1) in the custom board. We evaluated both the custom board and EVM board with SMD chip antenna on board and found that our custom board is still under performed when comparing with EVM.
In custom board , we followed the impedance of RF trace as 50 ohms as per stack up information from the fab house.
As per my understanding , only difference between EVM(WL1835MODCOM8B) and our custom board is the number of layers but we have followed the 50 ohm RF trace impedance , also we have provided proper void under antenna antenna location as in TI reference design.
Can you please suggest any way to improve the WiFi performance in my custom board?
