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CC2652R: PA LNA design for CC2652R

Part Number: CC2652R
Other Parts Discussed in Thread: CC2650, CC2592

We are considering CC2652R for our upcoming products. However we need a PA LNA for a better range. Launchpad design doesn't include any PA LNA. Some online research revealed that I can use the reference design of CC2650+2592 as shown below:

Q1 - Can I copy this design for the RF part starting from RF_P and RF_N pins?

Q2 - For cc2650+2592, PA_EN, LNA_EN and HGM pins are connected to DIO 7, 13 and 14 respectively. Where should I connect those pins in case of CC2652r?

Q3 - There is a RF matching network between ANT pin of cc2592 and the antenna. It comprises of 5-6 components. Is it advisable to replace these components with a single balun component (ease of implementation is the major concern. other concerns are performance > cost > PCB area requirement)? If a balun component is advisable, which part number should I go with?

Q4 - How many copper layers should I use for best performance and passing compliance tests? What should be the stackup and thickness of copper and FR4 layers?

  • Hi Kumar,

    Manish Kumar20 said:
    Q1 - Can I copy this design for the RF part starting from RF_P and RF_N pins?

    Yes

    Manish Kumar20 said:
    Q2 - For cc2650+2592, PA_EN, LNA_EN and HGM pins are connected to DIO 7, 13 and 14 respectively. Where should I connect those pins in case of CC2652r?

    The RF core on CC26xx has internal signals to control external PA and LNA. Those can be mapped to any DIO, see chapter 13.3.2.1 in the TRM. This is also described here: http://www.ti.com/lit/ug/tidub71/tidub71.pdf 

    Manish Kumar20 said:
    Q3 - There is a RF matching network between ANT pin of cc2592 and the antenna. It comprises of 5-6 components. Is it advisable to replace these components with a single balun component (ease of implementation is the major concern. other concerns are performance > cost > PCB area requirement)? If a balun component is advisable, which part number should I go with?

    CC2592 has an internal BALUN. The external components between the ANT-pin and the antenna are a filter and RF matching. We recommend to copy this filter, except C15 and C27 which are antenna matching components and will probably be different on your custom board. However, you can initially use the C15 and C27 values on your first board spin.

    Manish Kumar20 said:
    Q4 - How many copper layers should I use for best performance and passing compliance tests? What should be the stackup and thickness of copper and FR4 layers?

    You should use at least 4 layers with a solid ground plane on layer 2 and power on layer 3. The stackup can be found here: http://www.ti.com/lit/df/tidriz9/tidriz9.pdf  design files, which we recommend to follow, can be found here: http://www.ti.com/tool/TIDC-CC2650-CC2592-EMK