Other Parts Discussed in Thread: CC2640
Tool/software: Code Composer Studio
Hi everyone! We have designed a custom PCB mounting the CC2650F128RSM (4x4 mm ) and we are now experiencing the following situation:
We are usign the LaunchPad cc2650 rev 1.1 to act as a programmer, with the xds110 debugger platform (connecting the debugger to the external target)
1. Flash Programmer 2 Studio is able to correctly detect the microcontroller, read the flash memory, erase it, acquire information about MAC addresses and eventually program it downloading some binary files (samples and tests of Flash Programmer 2 Studio) into our target microcontroller. Without any apparent problem (with a successful outcome).
2. SmartRF Studio, on the contrary, is able to detect it but as soon as it is launched it quickly overheats the microcontroller case, we are not able to perform any further operation (like changing the target device or others). We have to disconnect it and erase the flash to remove any program on it and cool it down.
3. On Code Composer Studio, we have tried to use some template projects (we actually tried also the hello world, but we experienced the well-known issues about linking other libraries and successfully building the project) so we ended up by expoiting the BLE stack 2.02.01.18. The building is completed as well as the downloading of the stack (without any "hot" problem), but as soon as we try to download the app, the problem of overheating reappears.
4. Sensor Controller Studio presented the same overheating when trying to upload the Uart Emulator project example. As SmartRF Studio, as soon as we connect to the microcontroller, the overheating appears. We need to disconnect immediately and erase the flash with Flash Programmer.
We would like to exclude any issue regarding a wrong choice of package: we have noticed all the programs come with the default 7x7 mm package versions. Is the compiler and the downloader able to adjust and recognise the different package (on the BLE Stack's development guide it is suggested, in order to build everything correctly, not to change the version of the target leaving it as default.
Since it is one of our first PCB design, we also tried to exclude any problem related to the physical assembly of components. We checked for some shorts, at least the visible ones.
Some questions:
> Can it depend on the thermal central pad? We grounded it but we are not sure it is completely solded to the board.
> Can it depend on some SW configuration not aligned with our design?
> How could we avoid any problems of reflections, keeping the RF module completely shut down while we use our CC2650 to run other applications?
> In the proposed attachment, our schematics: we followed the design adopted for the Sensor Tag, we are using the RF module with internal BIAS, using the DC_DC switch and operating in differential mode.
Thanks to everyone for any suggestions, ideas and answers for relieving our CC2650 by any other sufference! :(
Have a nice day! :)