The TI E2E™ design support forums will undergo maintenance from July 11 to July 13. If you need design support during this time, open a new support request with our customer support center.



Search tips
Showing 1 results View by: Thread Post Sort by
    Answered

  • LMH6644-MIL: Bond & Ground Pad Gold thickness

    Resolved
    Part Number: LMH6644-MIL Other Parts Discussed in Thread: LMH6644 Tool/software: I would like to know the bond pad & ground pad gold thickness of LMH6644 MDC.
    • Resolved

Didn't find what you are looking for? Post a new question.