Part Number: LMP7704 Tool/software: I am using the LMP7704 as a buffer. When I perform an AC Analysis with the op amp supplied with +5V and -5V, the analysis shows a magnitude of 0dB at low frequency, which is what I would expect for a buffer with a…
Part Number: LMP7704-SP Other Parts Discussed in Thread: OPA206 Tool/software: I noticed that TI doesn’t publish input and output resistance values for op amps. Is there a reason? How do I determine the resistances for the LMP7704-SP op amp?
Part Number: LMP7704-SP Tool/software: Hi experts
I am looking for the TID report for the subject part.
Is there one that can be shared? If so, can someone get this added to the Technical Documentation section of the product folder?
Thanks!
Jim B
Part Number: LMP7704-SP Tool/software: We are using TI part number 5962R1920601VXC.
There is a thermal pad on the bottom of the CFP package.
1.Is it connected to ground or is it floated?
2. Is it Ok to connect the thermal pad to ground to dissipate…
Part Number: LMP7704-SP Hello,
I'm currently working on a design with the part 5962R1920601VXC (or the LMP7704-SP).
From the datasheet, there are given dimensions of 0.43mm MAX (from the bottom of the part to the leads) and 25mm MAX (lead tip-to-lead…
Part Number: LMP7704-SP Hi experts
The LMP7704-SP datasheet clearly states that the metal lid is connected to the V- pin, and that the backside metallization is connected to the metal lid.
Unfortunately the DLA SMD for this part states that the lid is…
Part Number: LMP7704 Exact observance: LMP7704MA IC is quad-precision OPAMP. Channel A is performing normally with a leakage bias current of 50pA(typical) but Channel D is not performing not same as channel A, it has leakage in the range of 10nA-100nA…
Part Number: LMP7704-SP Dear All,
I need an information about package of 5962R1920601VXC: from datasheet is not clear if the thermal pad on bottom side is present or not.
The datasheet showes both solution but I'm not able to find any indication. …
