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Showing 36 results View by: Thread Post Sort by
    Answered
  • THS3062: About microstrip technology for high-speed op amps

    Yatao Ling1
    Yatao Ling1
    Resolved
    Part Number: THS3062 Other Parts Discussed in Thread: TLV3502 Hi TI expert, I'm instructed to use microstrip technology to handle long-distance connections between high-speed op amps. That is, use ground fills on signal layers and leave the ground copper…
    • Resolved
    • over 7 years ago
    • Amplifiers
    • Amplifiers forum
  • Answered
  • THS3062: One problem about high speed op amps' PCB routing

    Yatao Ling1
    Yatao Ling1
    Resolved
    Part Number: THS3062 Hi TI expert, The schematic I'm talking about is as Fig1. My PCB is 4-layer. The trace,which is 10mil wide, is on top layer and about 50mm . Below is ground plane, power plane and bottom layer. I've removed all copper on gorund…
    • Resolved
    • over 7 years ago
    • Amplifiers
    • Amplifiers forum
  • THS3062: with power pad exhibiting overheating and shortened lifespan

    Tom Wolgat
    Tom Wolgat
    TI Thinks Resolved
    Part Number: THS3062 The third question is in addition to the first two I already posted regarding the same subject. 1, Could solder voids (on the power pad) cause overheating and shortened lifespan? Is there a specification for the maximum void on…
    • over 7 years ago
    • Amplifiers
    • Amplifiers forum
  • THS3062: Amplifier melts down for no apparent reason.

    Pablo Pombo
    Pablo Pombo
    TI Thinks Resolved
    Part Number: THS3062 I have been using this part in different products for ~8 years. Always successfully and more or less the same design, minor variations. All of a sudden this year we are getting a lot of parts the fail upon power up. We see perhaps…
    • over 7 years ago
    • Amplifiers
    • Amplifiers forum
  • THS3062: Having a problem with op amp overheating and shortened lifespan

    Tom Wolgat
    Tom Wolgat
    TI Thinks Resolved
    Part Number: THS3062 1. Solder voids suspected: Wondering if there is a specification for acceptable percentage of solder void on the heat sink, Cu pad that resides under the chip? PCB vendor claims that a 30% solder void on the heat sink, Cu pad under…
    • over 7 years ago
    • Amplifiers
    • Amplifiers forum
  • THS3061: Why THS3061 and THS3062's CMRR are so different

    Ricardo Li
    Ricardo Li
    TI Thinks Resolved
    Part Number: THS3061 Other Parts Discussed in Thread: THS3062 , Dear teams, THS3061 is a single amplifier, and THS3062 is a dual amplifier. Their electrical characteristics are almost the same. But their CMRR plot are dramatically different, Fig 31…
    • over 7 years ago
    • Amplifiers
    • Amplifiers forum
  • THS3062: How to amplify high-speed op amp's output current to drive load

    Yatao Ling1
    Yatao Ling1
    TI Thinks Resolved
    Part Number: THS3062 Other Parts Discussed in Thread: THS4631 Dear TI expert, My application is simplified as Fig1. In Fig1, high-speed op amps’ candidates are THS4631 and THS3062. The load is modelled as RC series branch and their approximate values…
    • over 8 years ago
    • Amplifiers
    • Amplifiers forum
  • Heating problem for THS3062

    prashanth p
    prashanth p
    I am operating this IC with +15v and -15v supply I have tested with buffer circuit its getting heated. and then I have removed the Buffer circuit just given dual supply voltage of 15volts only even then also the IC getting heated. Is there any solution…
    • over 10 years ago
    • Amplifiers
    • Amplifiers forum
  • RE: THS3062 Bandwidth at 1MHz begins amplifying signal

    Samir Cherian
    Samir Cherian
    Hello Nate, Do the oscillations happen even without the ac signal being applied to the amplifier input? If you do check for oscillations without an input ac signal please ensure that the noninverting pin of the amplifier has a low impedance path to GND…
    • over 10 years ago
    • Amplifiers
    • Amplifiers forum
  • Answered
  • THS3062 - junction to pad thermal resistance

    Johannes Neumann
    Johannes Neumann
    Resolved
    Other Parts Discussed in Thread: THS3062 Hello, we are currently creating a thermal simulation model for one of our products that features the THS3062DDA. The SLMA002G PowerPad Application Report mentions how the individual thermal resistances (e.g…
    • Resolved
    • over 10 years ago
    • Amplifiers
    • Amplifiers forum
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