Because of the Thanksgiving holiday in the U.S., TI E2E™ design support forum responses may be delayed from November 25 through December 2. Thank you for your patience.

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

LM675: Thermal Resistance

Part Number: LM675

Hello Team,

Can you tell me the Thermal Resistance (θJA, θJC, θJP) of LM675?

I would like to compare with other products.

Regards,

Masakazu

  • Adachi-san,

    The LM675 datasheet in the Power Dissipation and Heat Sinking section on Pg. 8 mentions:

    θjA = 54°C/W for a TO-220 package (LM675)

    θjC = 2°C/W

    There is no mention of θjP in the datasheet so we do not have that information for that particular thermal resistance parameter.

    Figure 8, Device Dissipation vs Ambient Temperature, on datasheet Pg. 4 provides useful information about LM675 power dissipation vs. temperature for heatsinks having different thermal resistances.

    Regards, Thomas

    Precision Amplifiers Applications Engineering

  • Hello Thomas-san,

    Thanks to the support!

    I understand.

    Regards,

    Adachi