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OPA547: version T-1 (pth) can be soldered with pin in paste process?

Simone Alberghini
Prodigy 10 points
Part Number: OPA547

Will the part OPA547T-1 withstand the reflow oven temperature? 

Thank you.

  • 0
    TI__Mastermind 22110 points

    Hello Simone, 

    The recommended guidance we provide is shown below for this device. The vapor phase or IR reflow techniques are recommended.  Can you provide more details such as the oven reflow profile (time and temperature). 

    Best Regards, 

    Chris Featherstone

  • 0 in reply to Chris Featherstone
    Prodigy 10 points

    Hi Chris, the reflow profile would be with a peak temp. not higher than 245°C; by the way, the highlighted note reports informations about the F version, which is the DDPACK, SMD version of the component. I want to reflow the T-1 version (PTH) with a pin in paste process. I may imagine that the component is the same, just with different package, so the PTH version should also have the same maximum rating, but I was unable to get this info in the data sheet.

    Tahnk You, best regards.

  • +1 in reply to Simone Alberghini
    TI__Guru 54941 points

    Hello Simone,

    Simone Alberghini said:
    the component is the same, just with different package

    Yes, the components are the identical, except package differently. In terms of the soldering recommendation, the above guideline should be applicable to the all three packages below.  

    If you have additional questions, please let us know. 

    Best,

    Raymond