XTR300: Cavity / PIND Question

Hi Steve, 

Steve Widener said:

Please advise whether this device is considered a “cavity” part. If so, whether TI performed any PIND test?

I am not aware that PIND test is conducted in the XTR300 device. I think that PIND test is used to identify particles that could result electrical shorts or other malfunctions with the IC encapsulated device. I can understand the this tests will be performed on hybrid hermetically sealed package. In XTR300, there is no "cavity" in the part, where epoxy molding compounds are injected filled up the entire IC "cavity"- die, bonding materials voids and air gaps.  

You have to ask the IC process engineer team. I do not have the information. I doubt that PIND test is performed over the manufacturing process. Maybe we have the tool in failure analysis support team. 

To my knowledge, PIND (Particle Impact Noise Detection) is not a standard IC manufacturing process. It is an inspection and testing technique used to verify the quality and reliability of finished integrated circuits (ICs) or other microelectronic devices after the manufacturing process.

If you have other questions, please let us know. 

Best,

Raymond