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OPA2836: RMC and RUN package

Austin Do
Intellectual 2175 points
Part Number: OPA2836

Hello team,

What is the difference between RMC and RUC packages?

Each package height is different, but it seems pitch and pin-out are same. are they compatible with each other?

Also, I think there is a typo in CAD symbol website.

Best Regards,

Austin

  • 0
    TI__Expert 6050 points

    Hi Austin,

    RMC and RUN packages are both part of the QFN (Quad Flatpack No-leads) package families. The RMC package is from the UQFN family while the RUN package is from the WQFN family. As you have noted, the have the same pitch and pinout with the only difference being the package height. The footprint of these devices are the exact same so the packages can be used interchangeably on PCB layouts. 

    Also, as you have noted, there is a typo on the symbol in the CAD symbol website. I will bring this to the attention of the team to have corrected.  Please refer to the pinout of the device in the datasheet.

    Thanks,

    Nick