Hi TI Team，
According to the feedback from TI CQE, the LM293DGKR process has been changed, and the screen printing on the chip surface has also been changed. The following customer applied two batches of different incoming materials and 100% failed the test. Please provide the specific scheme parameters that need to be changed for the peripheral circuit of the batch of chips after the process change, thank you!
The following customer description,
The model of LM293DGKR and TI was delivered 2500pcs last week. After our QC inspection, the printing does not contain the word "TI", so it cannot be used. Our company has had two quality abnormalities of this model.
The products with "TI" printing can pass the test, and those without "TI" will be 100% tested. The following email replies that the original factory has changed the printing, and the subsequent deliveries all contain the printing of "TI";
据TI CQE反馈，LM293DGKR是工艺改变了，芯片表面丝印也有改变，如下客户应用两批次不一样的来料出现了100%测试不通过，请提供更改工艺后批次芯片的外围电路需要更改的具体方案参数，谢谢！
如下客户描述，
LM293DGKR,TI 这个型号上周交货2500pcs，经我司QC检验，印字不含“TI”字样，不能使用，这款型号我司发生2次品质异常；
换上含“TI”印字的产品就能测试通过，不含“TI字样”的就100%测试不过。如下邮件回复原厂变更了印字，后续交货都是含“TI”印字；
