Hi support team all.
I have two question about temperature spec.
<Question>
1.Do the above two temperature ranges refer to ambient temperature, junction temperature, or case temperature?
2.What part of the device is TCASE?
There is an option for the package to have a heat dissipation pad on the top or bottom, but does that mean the surface temperature is on the plastic mold side rather than the heat dissipation pad?
Best regards,
Higa
Hi Higa-san,
Please take a look at OPA564-Q1 part, which is automotive grade OPA564. The OPA564-Q1 is revised recently, but it is using the same die design as OPA564.
1.Do the above two temperature ranges refer to ambient temperature, junction temperature, or case temperature?
The specific range refers to the datasheet's performance specifications that are guaranteed and specified within the -40C to 85C, Tamb operating temperature.
Operating range refers to the OPA564 is capable to operate from -40C to 125C, but the performance specification above 85C is not specified, will deviate from the max. or typical figure stated in the datasheet.
If you use OPA564-Q1 part, then the specified and operating ranges are specified from -40C to 125C, which a standard automotive compliance.
2.What part of the device is TCASE?
TCASE refers to the hottest part of heat sink area, which the OPA564 has two heat sink options, where heat sinks are encapsulated on top or encapsulated on the bottom. OPA564-Q1 has only one option, which the heat sink is allocated on the bottom part of the power amplifier (use PCB to dissipate the excessive heat from the IC's power dissipation).
If you have other questions, please let us know.
Best,
Raymond
