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AMC0380D-Q1: AMC0381D-Q1

Srushti Ethape
Prodigy 10 points
Part Number: AMC0380D-Q1
Other Parts Discussed in Thread: AMC0381D-Q1

Tool/software:

1 . In the layout guidelines of AMC0381D-Q1 , there is nothing mentioned related to inner layers and bottom layer placement and routing.

We are using this IC in our 6-layer board and would like to know the guidelines for routing VDD1 and GND1 planes in inner layer under this IC. Also is there any placement restrictions on bottom side for other components , if this IC is placed on TOP layer?

2. As per layout guideline >9.2 mm creepage is required between HVIN pin and VDD2 Pin .

Actual distance between these two pins is approx.  8.232mm. If we add slot on PCB this will increase creepage  distance on PCB, but IC itself has lower creepage than 9.2mm.  Please guide how to achieve this creepage requirement.

  • 0
    TI__Guru 55652 points

    Hi Srushti,

    1. In general it is best practice to avoid routing beneath the IC, but the layout in regards to the inner and bottom layers will be dependent on your PCB construction and system expectations. Check with your PCB manufacturer on the dielectric strength of the material, loss due to aging and manufacturing tolerance. 

    Placement of another IC on the opposite side of the PCB should be OK since there is not inductive elements included in the design. 

    2. Maintaining 8mm creepage is essential, same as between GND1 and DGND shown on the bottom side of the layout example. The 9.2mm creepage shown in the example is calculated with right angles as shown by the drawn line. A slot should not be necessary.