TLV9001: TLV9001 vs TLV6001

Kazuki Itoh

Genius 10680 points

Part Number: TLV9001
Other Parts Discussed in Thread: TLV6001

Tool/software:

Hi team,

My customer is considering to migrate from TLV6001 to TLV9001.

Could you let me know about following items?

ESD rating is degraded from +/-4000V to +/- 2000V by upgrading to TLV9001.
Why does the ESD rating degrade like this?
Why the thermal resistance is increased by the factor of 1.4 to 1.6?
- Junction-to-Case: 91.6℃/W ⇒ 148.5℃/W
- Junction-to-Board:　59.6℃/W ⇒ 82.3℃/W

Best regards,

Kazuki Itoh

2 months ago

+1 Clemens Ladisch 2 months ago

Guru 316410 points

The TLV9001 is more cost efficient because it uses a smaller die. But this leaves less space for ESD protection, and reduces the ability to conduct away heat.

+1 Marek Lis 2 months ago in reply to Clemens Ladisch

TI__Guru 67591 points

Fully agree with Clemens. Thank you for reply.

0 Kazuki Itoh 2 months ago in reply to Marek Lis

TI__Genius 10680 points

Hi Clemens, Marek,

Thank you for your comment.

Where specifically the space is reduced for ESD protection?

Do you mean it made the space for ESD guard ring smaller?

Best regards,

Kazuki Itoh

0 Marek Lis 2 months ago in reply to Kazuki Itoh

TI__Guru 67591 points

What Clemens meant is to say that there are more than one set of ESD diodes for given wafer process. Thus, a smaller (less robust) ESD diodes may have to be used to fit in a smaller package.

Amplifiers

Amplifiers forum

TLV9001: TLV9001 vs TLV6001