Hello,
The peripheral circuit of the TPA3255 has been checked and confirmed to follow the datasheet recommendations.
We have isolated the TPA3255 section for individual validation.
The amplifier supply voltage is 50V. During load testing, the device enters OTP due to overheating, and the output can only reach around 10W.
We later discovered that the PVDD decoupling capacitors were not placed close enough to the IC pins due to a layout issue. After manually reworking and moving the capacitors closer to the PVDD pins, thermal performance improved slightly, allowing the output to reach about 25W.
I would like to ask what other design or layout issues could cause abnormal temperature rise on the IC.
Are there additional factors we should check regarding PCB layout, thermal dissipation, switching node routing, or component placement that may affect TPA3255 thermal behavior?
