Alpha,
I am not sure what your channel variation question refers to? A channel to channel separation or correlation of various parameters between the channels inside the same package? If the former is the case, please see below the graph of channel separation vs frequency but if your question refers to the latter, in general there is no correlation between the specs that are centered around zero (like Vos, offset drift) - they are random in nature - while the single-ended specs which are typically a function of matching of wafer process sheet resistance and capacitance (specs like IQ, slew rate, bandwidth, noise, etc.) track each other within few percent not only between channels but also for all the units coming from the same wafer lot.
