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TLV2762IDGK supply current out of spec, solder problem?

Volker Placke
Prodigy 140 points
Other Parts Discussed in Thread: TLV2762

Hello all,

we use TLV2762IDGK which show too much supply current at 3,3V. ( About 20 times too much; no current out of the output! All impedances on the in- and outputs well behaved :-)

This failure occurs on one out of four boards and if it occurs always on the same side. The board is double sided and OPAmps of the type TLV2762 are populated on both sides.

As this failure occurs always on the same side but not in all boards, we guess that it could result of the solder process.

The boards are prototypes which were manufactured on the prototype line of a professional EMS. The manufacturer told us, the solder temperature profile would be OK.

Now the question: Could it be, that the current consumption of the TLV2762 rises to values far out of spec, while the device behaves normally elsewhere?

Could too much heat provoke such a failure?

Where can the solder profile be found? The datasheet states: "Level-1-260C-UNLIM" but I could not find this specs on the TI webside.

  • 0
    TI__Guru* 93105 points

    Hello Volker,

    The TLV2762 is fully tested before being packaged for delivery. One of the standard tests is current consumption, or quiescent current, which is limited to 28 uA, at room temperature. It would not be normal under any circumstances for the current to be above that maximum while operating in a quiescent state, at room temperature. Normal reflow soldering temperatures and profiles should not damage the device.

    I found this wiki on the TI website. Hopefully this will answer your questions about reflow profiles:

    http://processors.wiki.ti.com/index.php/Package_Reflow_Profiles

    High operating current also could be caused by ESD damage incurred during handling, or instability (oscillation) when placed in an unstable application, and some short-circuit configurations.

    Regards, Thomas

    PA - Linear Applications Engineering