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OPA2613 Thermal Considerations

Cris Schiebold
Prodigy 50 points
Other Parts Discussed in Thread: OPA2613

The OPA2613 is only available in a SOIC package. It looks like the HSOP (power package) has been discontinued. This is odd that a high power op amp is only available in package that has a thermal resistance of 125C/W. Is there any way to pull more heat out of the SOIC package?  Or will TI be putting the OPA2613 in a power-appropriate package?

Thanks, Cris

  • 0
    TI__Genius 13935 points
    Hello Cris,

    There are ways to get more heat from an SOIC package. One is to put a thermal pad under the part and use thermal gel to move heat from the device to the PCB. The other method is to use a heat sink on the top of the SOIC package. This works best when there is a metal case nearby and you can use a foam heat conductor.

    Another option is to use moving air.

    I am not aware of any new package development on this part, I would have to ask.

    Regards,
    Loren
  • 0 in reply to Loren Siebert 1
    Prodigy 50 points
    Loren:

    Thanks. I understand that there are other ways to try and pull heat out of a SOIC package, but was hoping TI would have given more information for that. For example, if we heatsink the top of the package, what is the thermal resistance from the junction to the top of the package? Or what is the thermal resistance to one of the leads? Is there a lead that is connected to the backside of the die that is effective to pull heat out of the package?

    This part is a high power part, it is very odd they would not address these issues. Yes, if you could ask why the SOIC with the power pad was discontinued that might help.

    Regards, Cris
  • 0 in reply to Cris Schiebold
    TI__Genius 13935 points

    Hello Cris,

     

    I looked up similar parts in our thermal database and it looks like the Theta JC for this part will be around 40 Degrees C/ W. 

    None of the leads are connected to the substrate, but normally the power leads are connected to the most metal on chip, so if you can put more copper on those leads it will help.  The next best will be the output pins. 

    I can't help you with the power pad question.  This part was released by a different group. 

     

    Regards,

    Loren