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LMH6321: SO Power Pad Connection

Richard Elmquist
Mastermind 45250 points
Part Number: LMH6321

I am not sure of how the pad should be connected with this part. Is it supposed to be connected to GND or to the lowest voltage present? I am assuming that my customer should use vias for this connection?

Can you also show me where the CL pin is actually connected in figure 51? My customer is asking how this pin is referenced to GND.

Thanks for your help with this!

Richard Elmquist

  • 0
    TI__Mastermind 45250 points

    Has anyone had a chance to look at the request above?

    Can you give a time frame as to when you might be able to provide the information?

    Thanks for your help with this!

    Richard Elmquist

  • 0 in reply to Richard Elmquist
    TI__Guru 54076 points

    Hi Richard,

    It's not my part anymore...but I was involved with originally releasing it.

    The tab/pad must be connected to the same potential as the V- pin. The back of the die is at V- potential, and is mounted to the leadframe paddle (center pin on TO package, or thermal pad on SO package). Connecting the pad to another voltage would probably blow the V- bond wire or die metalization.

    The note on the front page says "V− pin is connected to tab on back of each package", and the Apps section repeats this in the Heatsinking section in the Application Section:

    "To accomplish heat sinking, the tabs on DDPAK and SO PowerPAD package may be soldered to the copper plane of a PCB for heatsinking (note that these tabs are electrically connected to the most negative point in the circuit, i. e.,V−)."

    So tie the tab/pad to the V- pin.... Not the most convenient if using split supplies...but necessary.


  • 0 in reply to Paul Grohe
    TI__Mastermind 45250 points

    Paul,

    Thanks for your help with this!

    Have a great day!

    Richard Elmquist