ONET8551T: Bond Pad Material

Quince Jackson26

Prodigy 60 points

Part Number: ONET8551T
Other Parts Discussed in Thread: ONET2804T

I have multiple questions to help us develop our process to assemble the bare die boards:

What is the bond material?

What is the passivation material?

Are there suggested bonding parameters?

over 6 years ago

0 Jacob Freet over 6 years ago

TI__Expert 8380 points

Hi Quince,

I believe the bond pads are aluminum, but I will double check to make sure they are not a specific alloy. We don't have any specific bonding parameters other than trying to minimize the wire length to reduce inductance.

Regards,

0 Loren Siebert 1 over 6 years ago in reply to Jacob Freet

TI__Genius 13935 points

Hi Jacob, Quince,

I have confirmed that the bond pads are aluminum. I don't have an answer for the passivation yet. I would guess silicon dioxide, but I am not sure.

Page 24 of the ONET2804T datasheet has some guidance on bond wire configuration.

Regards,

Loren

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ONET8551T: Bond Pad Material