Hopefully a simple question
I'm planning on using a OPA211-HT op amp, the only high temp packages available are ceramic dual flatpack (HKJ) and the ceramic gull wing (HKQ). The HKJ needs lead forming which i don't want to do, so that leaves the HKQ gull wing.
this part appears to be upside down? ie the lid of the device will be flush the PCB
So my question could TI confirm the pin numbering of the footprint is flipped?
picture of my footprint below
Kind Regards
Martin
