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LM239-N: Big differences with the code LM239N?

Giacomo Bichicchi
Prodigy 10 points
Part Number: LM239-N
Other Parts Discussed in Thread: LM239

Due to obsolescence of the LM239J code, I have to take countermeasures.
I summarily compared the LM239J (or LM239-N) and LM239N code datasheets.
Apart from the package (ceramic and plastic), what are the big differences?

  • 0
    TI__Guru 54446 points

    Hi Giacomo,

    They are slightly different. Do not confuse the "N" package designator and "-N" ex-National PN designator.

    The LM239J (LM239-N) is the old National Semiconductor device in ceramic DIP. The old NSC parts with duplicate part numbers received a "-N" in the generic part number after the acquisition.

    The LM239N (LM239) is the Texas Instruments second source device to the original National LM239N plastic DIP.

    After the acquisition, the National LM239N (LM239-N) was obsoleted with the "replacement" being the TI  LM239N (LM239)

    The die and semiconductor process are different. The basic transistor circuit level design is nearly identical, but may differ in the edges of operation.

    The two devices are as similar as two similar designs, on two different semiconductor processes, by two different semiconductor companies (at the time) can be.

    For 95% of the use cases, they are identical. If you are pushing the limits of any parameter, you may see a difference.

    So...Nutshell..

    LM239J = Original NSC die in Ceramic Dip  (not RoHS)

    LM239N = TI die in epoxy DIP (RoHS)

    There are no TI devices in ceramic DIP. For that temp range, ceramic is not needed and plastic should suffice for most applications.

    The LM239J/NOPB "Green' version was obsoleted for just that reason. The non-RoHS "J" is still available for for customers who need the leaded finish to support existing programs - but I would not recommend it for new designs.