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OPA-170-DIE

Dave Dawson
Prodigy 20 points

Could you clarify the ordering options for this die?

I would like to use the die in a application where AlSi wire bonding would be used. Is it possible to receive the die for this process, or are all die metallised for use with Flip-chip processing?

  • 0
    TI__Guru* 93105 points

    Hi Dave,

    It took some searching to find the answer to your question regarding the OPA170-DIE because die are processed by a different TI group. The OPA170-DIE bond-pad is AlCu over TiN barrier metal.  It is suitable for conventional wirebonding. The metal, as is, isn't intended to be used for flip-chip processes.

     Regards, Thomas

    PA - Linear Applications Engineering