TAS5630B heatsink design recommendations

David Lambert1

Other Parts Discussed in Thread: TAS5630B

The TAS5630B specification refers to documents SLMA002 & SLMA004 for heatsink design guidelines, but those documents only discuss bottom-mounted PowerPADs. Is there any guidelines for top-mounted PowerPADs as used by the TAS5630B? I'm interested in the PHD package.

Dave

over 12 years ago

0 user5276421 over 12 years ago

TI__Mastermind 37045 points

Hi Dave,

Please see below link for similar discussion -

http://e2e.ti.com/support/amplifiers/audio_amplifiers/f/6/t/275996.aspx

reg,

Paul.

0 David Lambert1 over 12 years ago in reply to user5276421

Prodigy 60 points

Hi Paul, I've seen those posts but they discuss the type of thermal compound to use between the heat sink and the power pad. Do you have any information that describes the mechanical recommendations for the heat sink itself? Specifically, it's size (in relation to the Power pad heat slug) and the force to apply?

Dave