TPA2011D1 / Land Pattern Recommendations for PCB layout

Ryuji

Guru 20090 points

Other Parts Discussed in Thread: TPA2011D1

Hello,

Could you please share the land pattern recommendations for PCB layout of TPA2011D1 with us?
We need it for parts registration of our customer.

Best Regards,
Ryuji Asaka

over 10 years ago

0 Mohamed Hellal over 10 years ago

TI__Intellectual 2285 points

Hello,

Solder pad definitions: Nonsolder mask defined

Copper pad: 0.23 mm

Solder mask opening: 0.310 mm

Copper thickness: 0.032 mm

Stencil opening: 0.275 mm x 0.275 mm Sq. (rounded corners)

Stencil thickness: 0.1 mm thick

For more information please refer to the page 18 of the TPA2011D1 datasheet

Regards,

Mohamed Hellal

0 Ryuji over 10 years ago in reply to Mohamed Hellal

Guru 20090 points

Hello Mohamed san,

Thank you for the reply.
I understood the information in the datasheet.
Are there the land pattern recommendation as attached image ?
I need the land pattern recommendation as attached.

Best Regards,
Ryuji Asaka

0 Ryuji over 10 years ago in reply to Mohamed Hellal

Guru 20090 points

Hello Mohamed san,

Can I consider attached image as recommend land pattern ?

Best Regards,
Ryuji Asaka

0 Mohamed Hellal over 10 years ago in reply to Ryuji

TI__Intellectual 2285 points

Hello Ryuji-san,

it seems that you want to have a longer pitch (0.50 instead of 0.40).. This could create a short between the ball even if it's a 9 pins device.
I would recommend you to follow the package material information in the datasheet page 23.

Best regards,
Mohamed Hellal

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TPA2011D1 / Land Pattern Recommendations for PCB layout