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TPA2011D1 / Land Pattern Recommendations for PCB layout

Ryuji
Guru 20090 points
Other Parts Discussed in Thread: TPA2011D1

Hello,

Could you please share the land pattern recommendations for PCB layout of TPA2011D1 with us?
We need it  for parts registration of our customer.

Best Regards,
Ryuji Asaka

  • 0
    TI__Intellectual 2285 points

    Hello, 

    Solder pad definitions: Nonsolder mask defined

    Copper pad: 0.23 mm

    Solder mask opening: 0.310 mm

    Copper thickness: 0.032 mm

    Stencil opening: 0.275 mm x 0.275 mm Sq. (rounded corners)

    Stencil thickness: 0.1 mm thick

     

    For more information please refer to the page 18 of the TPA2011D1 datasheet

     

    Regards, 

    Mohamed Hellal

  • 0 in reply to Mohamed Hellal
    Guru 20090 points

    Hello Mohamed san,

    Thank you for the reply.
    I understood the information in the datasheet.
    Are there the land pattern recommendation as attached image ?
    I need the land pattern recommendation as attached.

    Best Regards,
    Ryuji Asaka

  • 0 in reply to Mohamed Hellal
    Guru 20090 points

    Hello Mohamed san,

    Can I consider attached image as recommend land pattern ?

    Best Regards,
    Ryuji Asaka

  • 0 in reply to Ryuji
    TI__Intellectual 2285 points
    Hello Ryuji-san,

    it seems that you want to have a longer pitch (0.50 instead of 0.40).. This could create a short between the ball even if it's a 9 pins device.
    I would recommend you to follow the package material information in the datasheet page 23.

    Best regards,
    Mohamed Hellal