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LMKDB1120: the crack is exist between substrates and pad root of component

Koo Richard
Prodigy 10 points
Part Number: LMKDB1120

Wistron re-done 3A validation for another motherboad, the same location, PLMKDB1120NPPR,

The engineers placed motherboard into inkwell, and then dry motherboard, engineer hard pull off this device from motherboard, result as below picture.  

It seems that red ink infusioRE_ 071_01120_M001(PLMKDB1120NPPR)-Dell project 17G 3A HPM abnormality- Red ink infiltration!.msgn into component’s substrates, its meaning the crack is exist between substrates and pad root of component, is it normal for this device? Please help send TI professor to get comment. Thanks!

  • 0 in reply to Koo Richard
    TI__Genius 10975 points

    Hello Koo,

    I'm currently checking with my operations team and will get back to you as soon as I have an answer. I'll provide an update by tomorrow.

    Best,

    Andrea

  • 0 in reply to Andrea Vallenilla
    TI__Genius 10975 points

    Hello Koo,

    If you see a red pad on the PCB or the substrate, that means the solder joint didn’t have good contact with the pad or the joint is too small (insufficient solder). My team suggested to check the PCB Gerber file and stencil to double check. Feel free to attach them to this thread and I can send them over to them. To check whether there was enough solder printed, check SPI data, and for thorough analysis, 3D X-ray is the best tool to determine if the solder joints made contact with the pads.

    Could you also attach a zoom side view? Since the affected location are at the corners, this may give us an idea on how the solder joint looks like.

    Best,

    Andrea

  • 0 in reply to Andrea Vallenilla
    Prodigy 10 points

    hello, Andrea,

    Maybe you are misunderstand my questions.

    Now issue between TI component substrate and TI solder ball. not relative to PCB.

    Wistron engineers found crack and cause to ink immersion TI substrates. please double re-view my provided information. 

    thanks!

  • 0 in reply to Koo Richard
    Prodigy 10 points

    Hello Andrea,

    The relative issues:

    Wistron engineers do cross section for TI location on the PCBA. cross section result as below pictures.Dell want to know below qustions result.

    No 1: Is VIA hole designed for VIPPO? can you help provide physical structure for this device to Dell reference.

    No 2: Why the pad such roughness? what are specification? 

  • 0 in reply to Koo Richard
    TI__Prodigy 40 points

    Hello Richard, there seems to be some confusion. LMKDB1120 is an LGA (like QFN), there is no balls on the device. And referring to the email that you sent earlier, the pictures analysis was referring red ink infusion to PCB substrates. Anyway, I'd suggest that we have a call on this so that we can clarify some of the issue and provide the information needed. Since this is packaging related, I'll have to pull in respective Product engineering and packaging team to help. I'll respond to the email and have Yu Chen's help to setup the meeting.  

  • 0 in reply to CP Ong
    Prodigy 10 points

    Hi Andrea,

    the device package:LGA. maybe my description not accuracy. 

    please help ask Yu-chen to build a meeting in recent days. Dell SQE will join in call meeeting together. 

  • 0 in reply to Koo Richard
    TI__Prodigy 40 points

    Let's move this to email and meeting communication. Already sent separate email  to Yu-Chen to setup the meeting and will pull in PE and packaging engineer if needed.

  • 0 in reply to CP Ong
    Prodigy 10 points

    OK, thanks!