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Hello,
Look at datasheet and lib from TI website.
It seems all the vias in pad are opened in soldermask layer.
From my experience, such via should be covered by soldermask green oil to avoid solder paste in vias.
Could you check?
Hi Shen,
Your statement is correct, we would recommend to fill all the via in the device ground paddle with solder or non-conductive epoxy to avoid solder flowing/wicking into the vias during the assembly reflow process.
For added thermal and ground connection robustness, we would also recommend to breakup the pad into several smaller squares (4-9). See pic attached.
Regards,
Rob