Would it be ok to run a trace like the green one under the device, as long as it does not go under the thermal pad? And also if you place a via (not a thermal via, not connected to the device) like the green one in the top right corner?
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Would it be ok to run a trace like the green one under the device, as long as it does not go under the thermal pad? And also if you place a via (not a thermal via, not connected to the device) like the green one in the top right corner?
Hi Charles,
Our device experts that support this device are out of the office this week. Please expect a response early next week.
Best regards,
Bob B
Hello Charles,
Yes, as long as you do not violate any DRC's for your board manufacturer or assembly, then you can place vias as suggested. Please note that we suggest a thermal pad 8mm x 8mm beneath the device for good mechanical and thermal connection to an internal plane.
Regards,
Keith Nicholas
Precision ADC Applications