ADS124S08: Coefficient of thermal expansion

Hi Carlo,

This question doesn't come up very often, but I know in general it has been asked a couple of times on E2E for various devices. The package itself will have a variety of expansion materials including the die and attach methods used. What we usually specify in our quality evaluations are Temperature Cycling (TC) tests for the device. See the following for specific quality information regarding the ADS124S08RHB:

https://www.ti.com/qualificationsummary/qualsumm/home?actionId=2800&partNumber=ADS124S08IRHBR

The other concern is more specific as it relates to soldering to a PCB.  The package itself is copper pads with NiPdAu plating. The following post may be helpful:

https://e2e.ti.com/support/amplifiers/f/14/t/789140

Best regards,

Bob B