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TPS2121: About Layout Guidelines

Ryu Yamashita
Genius 3070 points
Part Number: TPS2121

Tool/software:

Hi team,

The layout guidelines state “For high current applications place vias under input and output pins to avoid current density and thermal resistance bottlenecks. Where does the high current start?
Are there any standards?

Best Regards,
Ryu.

  • 0
    TI__Guru 69515 points

    Hi Ryu,

    As such there is no standard. Following recommendation will give better thermal performance at any current level.

    Regards 

    Kunal Goel

  • 0 in reply to Kunal Goel
    Genius 3070 points

    Hi Kunal,

    Thank you for your reply.
    I asked this question because I am having difficulty installing vias in my current board design.
    I am not sure if I should proceed with the design without vias, so is there a standard, even if it is approximate?

    Best Regards,
    Ryu.

  • +1 in reply to Ryu Yamashita
    TI__Guru 69515 points

    Hi Ryu,

    There is no standard. It is just a recommendation.  You can add more copper in power plane if via is not there. 

    Regards

    Kunal Goel