Other Parts Discussed in Thread: SYSCONFIG The System Firmware (SYSFW) on AM64x and AM243x devices supports a Security Handover mechanism, which controls the transfer of security ownership between SYSFW and the application host. The full feature description…
Part Number: AM6442
Prior the SDK version v1
This FAQ discusses the steps to enable the MCELF encrypted boot in the MCU+ SDK v12.01.00.33 for AM64x and AM243x devices.
Part Number: AM2612-Q1 Other Parts Discussed in Thread: UNIFLASH
Hi expert,
Please provide steps to flash AM261 using UniFlash CLI tool.
Provide commands for relevant operations as well
Part Number: MSPM33C321A Other Parts Discussed in Thread: UNIFLASH , SYSCONFIG
1. Background
For bank swap, what really swapped is the address of bank0 and bank1. However for MSPM33C321A, not only MAIN FLASH but also NONMAIN FLASH will swap the…
Part Number: TDA4VH-Q1 Other Parts Discussed in Thread: TDA4VL , TDA4VM , TDA4VH
What data throughput can be achieved on TDA4 device in theory, and what throughput can be measured? And how to achieve measured throughput?
Part Number: F29H859TU-Q1
Hi experts,
Is it possible to write to CPU3 flash region from CPU1 in bank mode3. If so how to do this? Please provide example on how to do this.
Part Number: DRV8162 Other Parts Discussed in Thread: DRV8161 , DRV8353F
For BLDC motor drivers designed to support industrial functional safety applications, most of the extended documentation requires an NDA to be in place with TI in order to request…
Part Number: F29H85X-SOM-EVM
Hi expert,
I want to flash two images into same banks. Suppose my bootloader is taking flash space from 0x1000_0000 to 0x1000_CFFF. The application is taking space from 0x1000_D000. When flashing app, boot is getting erased…