Hi Team,
We would like to know recommended land pattern of AM26LS31CDBR.
Could you please let us know the information(application note etc.)?
Regards,
Hide
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Hi Hide,
The mechanical and land pattern data for available packages can be found at the end of the device datasheet. Is there some extra information you need that's not included here? If so, please be specific regarding the required dimensions.
Regards,
Eric Schott
Hi Hide,
Here is a application report with recommended land patterns for different TI package types. Does this contain the info you need?
Regards,
Eric Schott
Hide,
In the datasheet, the mechanical drawing for the DB package is the SSOP. A 28-pin example is shown, but the dimensions for the 16-pin SSOP package is shown in the table on the same document.
Regards,
Eric Hackett
Hi Eric-san,
Thank you for the information.
I understand that there is the mechanical drawing for the DB package in the datasheet.
However, there is not recommended land pattern.
Therefore, I would like to know the land pattern data of SSOP package(DB) so AM26LS31CDBR.
I guess that AM26LS31CDBR is 16pin of SSOP TypeⅡ.
So recommended land pattern is “X LAND WIDTH(mm)=0.451”.
Is my understanding correct?
If no, could you please let us know the correct information?
I’d greatly appreciate your verification.
Regards,
Hide
Hide-san,
That is correct, the landing pattern recommendation for the 16-pin SSOP package in the application report Eric Schott linked is what should be referenced. The pin pitch and width does not change based on the pin count.
Regards,
Eric Hackett