Does TI have an MSDI device that uses a hybrid mode for contact wetting? My understanding of contact wetting is that it is best to have voltage and current available when the contacts close so that oxidation will be removed. Continuous mode supplies this, but polling mode may not have the wetting current available when the contacts actually physically close, which may not be an issue if the engineer has absolute control over which switches will be inputs to the system. Perhaps a hybrid mode would be good (and possibly better than CCP): any contact that reads as open has its wetting current applied in a continuous manner, then when it detects as closed (after the filtering time) it switches to polled contact wetting, and finally when it next detects as open it reverts back to continuous wetting. This would yield the lower power benefits of polled mode, yet definitely have the wetting voltage/current available at the moment of contact closure. Does TI have this in an MSDI device?