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DS90UB953-Q1: Thermal data

Denny Huang
Expert 7170 points
Part Number: DS90UB953-Q1

Dear team

The customer would like to know the two questions, could you help to reply?

1. What is the recommended baking time and the number of times after TI’s IC is unpacked?

2. What is the maximum temperature allowed for the packaging material? 

Many thanks

Denny

  • 0
    TI__Mastermind 28240 points

    Hi Denny,

    In the Packaging Information page of the UB953 datasheet, the device is rated "Level-3-260C-168 HR". This means that it is rated for MSL3.

    1. But we do a 150 degrees Celsius dry bake for 4 hours. I am not aware of any limitations on the number of times you can execute the bake after the IC is unpacked. But I do know that our part can only withstand a limit of 3x reflows. 
    2. I do not believe we have a parameter for this. We don't recommend baking in the Tape and Reel carrier. And the temperature ratings for the IC itself are listed in the Absolute Maximum Ratings section of the datasheet.

    Best,

    Justin Phan