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DP83867IR: design difference between package options

Part Number: DP83867IR

Hello team,

My customer has designed with DP83867IRPAP(64-pin) with RGMII I/F for 1000BASE. However they would like to change device package to 48pin(DP83867IRRGZ) for small size.

They will confirm datasheet p.10-13 for this package change. Is there any other design changes needed from a design with PAP package?

Best regards,

  • Hi Taketo-san,

    The smaller package has a different pinout and footprint, and thus, adjustments will need to be made to the hardware. As you have mentioned, kindly refer to pages 9-13 to determine how to adjust the design based on the different pinout. There should be no major changes other than matching the external hardware with the new pin location.

    Please let me know if you have any further questions. Else, I will close this thread. 

    Thank you,

    Nikhil

    All information in this correspondence and in any related correspondence is provided “as is” and “with all faults”, and it is subject to TI’s Important Notice (http://www.ti.com/corp/docs/legal/important-notice.shtml).